| Mfg Part Number: PAL20R8AMJS 883B | Alternate P/N: PAL20R8AMJS883B | Manufacturer: Mmi Amd |
| NSN : 5962-01-201-7748 | NIIN : 012017748 | Item Name : Microcircuit Memory |
| CAGE Code : 50364 | FSC : 5962 Microcircuits Electronic |
Thank you for taking an interest in the various military NSN parts and aerospace parts we offer on our website. You have currently taken interest in part number PAL20R8AMJS 883B, a Mmi Amd item produced under CAGE Code 50364. For further identification purposes, part number PAL20R8AMJS 883B is also listed with the NSN 5962012017748, and it is organized under Federal Supply Class (FSC) 5962 Microcircuits Electronic for ease of procural. By filling out and submitting the form provided below, you will be able to receive purchasing options on this item directly from our staff. For us to best tailor our presented solution to your unique needs and restrictions alike, we ask that you please offer our team details like your desired quantity, target pricing, and expected fulfillment timeframe. We can even accommodate many time constraints and limitations that customers may face, so be sure to let us know of any requests when you submit an RFQ form for part number PAL20R8AMJS 883B.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-201-7748 Item Description: Microcircuit Memory | 5962 | 012017748 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Pal20r8amjs 883b | 5 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | RECEIVING SET AN/ALR56C |
| CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 14933-84129 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| PAL10L8MW-883 | PAL14L8MJ883B | PAL10L8MJ883B | PAL10L8MJ |
| PAL14H4MJ | PAL10L8MF883C | PAL10L8MJ | PAL10L8MJ-883B |
| PAL12L6MJ 883B | PAL14L4CN | PAL10L8CN | PAL0383AL |
| PAL10L8MJ | PAL10H8MF883C | PAL10L8CN | PAL12L10-MJ |
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